GlobalFoundries announced an FDX Fusion fully depleted silicon-on-insulator platform roadmap on October 9, with manufacturing planned for its Dresden site in 2028. The company targets sensing, processing, control and communication for edge and physical AI systems. This is a roadmap, not a commercially shipping new processor.
The company expects the first generation to deliver seven-nanometer-class digital performance and more than twice the density of first-generation FDX technology. Its companion release calls the target 7nm-like performance. Neither wording should be converted into an independently benchmarked result or a claim that a finished chip is already fabricated on a particular 7nm process.
The roadmap includes analog, mixed-signal, embedded-memory and radio-frequency capabilities alongside digital logic. GF names automotive systems, robotics, industrial automation, sensor fusion and connected devices as intended applications. Early customer evaluation does not establish production orders, final product performance or universal compatibility.
Demonstrator silicon is targeted for early customer evaluation in early 2027, and an initial process design kit is planned for mid-2027. These dates precede the planned manufacturing start. Developers should treat them as company targets rather than confirmed delivery dates for end-user products.
A separate October 9 release marks topping-out of the €1.1 billion SPRINT expansion in Dresden. GF expects annual site capacity to exceed one million 300mm wafers by the end of 2028. The construction milestone is not completed expansion capacity, and a wafer-capacity target is not the number of finished chips shipped.
Limits: the companion release says the actual start of FDX Fusion development work depends on German federal government approval of the IPCEI AST project start. Performance, density and schedules remain forward-looking company claims. The announcements do not establish a retail price, an independent benchmark or availability in a named consumer device.