TOPPAN announced on September 30, 2026 that it had established an FC-BGA substrate production site at Advanced Substrate Technologies in Singapore. FC-BGA means Flip Chip Ball Grid Array. These substrates are used in semiconductor packages for AI and networking equipment.
TOPPAN says this is its first FC-BGA production facility outside Japan. Its announcement dates the opening ceremony to September 29, not September 30. Broadcom's September 29 announcement describes AST as a joint venture between TOPPAN Holdings and Broadcom.
The plant overview lists about 95,000 square meters of total floor area, including about 70,000 square meters for phase-one operations, and an operation start of December 2026. An opening ceremony therefore should not be read as confirmation that commercial manufacturing is already running at full output.
TOPPAN says the site will focus on large-size, high-layer-count substrates for AI, machine learning and network switches, complementing its production base in Niigata, Japan. Its stated business goal is to raise FC-BGA production capacity to at least 2.5 times the fiscal 2022 level by the end of fiscal 2027. That is a capacity target, not measured current output or a guarantee that chip shortages have ended.
Source: https://www.holdings.toppan.com/en/news/2026/09/newsrelease260930_1.html